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Covalent adaptable network (CAN) polymers doped with conductive nanoparticles are an ideal candidate to create reshapeable, rehealable, and fully recyclable electronics. On the other hand, 3D printing as a deterministic manufacturing method has a significant potential to fabricate electronics with low cost and high design freedom. In this paper, we incorporate a conductive composite consisting of polyimine CAN and multi-wall carbon nanotubes into direct-ink-writing 3D printing to create polymeric sensors with outstanding reshaping, repairing, and recycling capabilities. The developed printable ink exhibits good printability, conductivity, and recyclability. The conductivity of printed polyimine composites is investigated at different temperatures and deformation strain levels. Their shape-reforming and Joule heating-induced interfacial welding effects are demonstrated and characterized. Finally, a temperature sensor is 3D printed with defined patterns of conductive pathways, which can be easily mounted onto 3D surfaces, repaired after damage, and recycled using solvents. The sensing capability of printed sensors is maintained after the repairing and recycling. Overall, the 3D printed reshapeable, rehealable, and recyclable sensors possess complex geometry and extend service life, which assist in the development of polymer-based electronics toward broad and sustainable applications.

 

Vitrimers with bond exchange reactions (BERs) are a class of covalent adaptable network (CAN) polymers at the forefront of recent polymer research. They exhibit malleable and self-healable behaviors and combine the advantages of easy processability of thermoplastics and excellent mechanical properties of thermosets. For thermally sensitive vitrimers, a molecular topology melting/frozen transition is triggered when the BERs are activated to rearrange the network architecture. Notable volume expansion and stress relaxation are accompanied, which can be used to identify the BER activation temperature and rate as well as to determine the malleability and interfacial welding kinetics of vitrimers. Existing works on vitrimers reveal the rate-dependent behaviors of the nonequilibrium network during the topology transition. However, it remains unclear what the quantitative relationship with heating rate is, and how it will affect the macroscopic stress relaxation. In this paper, we study the responses of an epoxy-based vitrimer subjected to a change in temperature and mechanical loading during the topology transition. Using thermal expansion tests, the thermal strain evolution is shown to depend on the temperature-changing rate, which reveals the nonequilibrium states with rate-dependent structural relaxation. The influences of structural relaxation on the stress relaxation behaviors are examined in both uniaxial tension and compression modes. Assisted by a theoretical model, the study reveals how to tune the material and thermal-temporal conditions to promote the contribution of BERs during the reprocessing of vitrimers.